Bond pad layout including floating conductive sections

A bonding pad arrangement to transmit signal to and from under-pad circuits, the bonding pad arrangement comprising:

• a top layer comprising conductive material;
• a bond wire bonded to a top surface of the top layer;
• an intermediate layer comprising conductive material, the intermediate layer between the top layer and the under-pad circuits, wherein the intermediate layer has (i) a first section to transmit signals between the top layer and the under-pad circuits and (ii) a second section that is electrically floating;
• and
• an interconnect electrically coupling the first section of the intermediate layer to the top layer,
• wherein the interconnect is arranged between a perimeter of the top layer and the intermediate layer, such that the interconnect forms a closed loop around the second section and such that the interconnect is located between the top layer and the intermediate layer.

A semiconductor device comprising:

• a first conductive layer comprising (i) one or more floating conductive sections that are electrically floating and (ii) a connected conductive section, wherein the one or more of floating conductive sections and the connected conductive section are coplanar;
• a second conductive layer above the first conductive layer, the second conductive layer electrically coupled to the connected conductive section of the first conductive layer;
• and
• a wire bonded to an upper section of the second conductive layer,
• wherein a combined area of the one or more floating conductive sections is at least half of an area of a continuous section of the second conductive layer.