Additive manufacturing for integrated circuit assembly connectors
AssigneeIntel Corporation
InventorsGeorgios Dogiamis, Feras Eid, Adel Elsherbini
Life of this patent
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Abstract
Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.
Claims13
An integrated circuit assembly, comprising:
- a dielectric material layer;
- a ground trace on the dielectric material layer;
- a signal trace on the dielectric material layer;
- and
- a cable connector comprising an alignment housing additively fused to the ground trace, wherein the alignment housing includes a cable mating opening and wherein the signal trace is within the cable mating opening.
An integrated circuit assembly, comprising:
- an electronic substrate having a first surface and an opposing second surface, wherein the electronic substrate includes at least one dielectric material layer, at least one ground trace on the dielectric material layer, and at least one signal trace on the dielectric material layer;
- a cable connector comprising an alignment housing additively fused to the ground trace, wherein the alignment housing includes a cable mating opening and wherein the signal trace is within the cable mating opening;
- a cable within the cable mating opening of the cable connector and electrically connected to the electronic substrate;
- and
- an integrated circuit device electrically attached to a first surface of the electronic substrate, wherein the cable is electrically connected to the integrated circuit device through the electronic substrate.
Dependencies are inferred from the claim text.