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US 11,887,941 B2Granted
Semiconductor module with reinforced sealing resin
AssigneeFuji Electric Co., Ltd.
InventorTomohiro Nishimura
Life of this patent
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Abstract
Provided is a semiconductor module, including: a semiconductor chip; a circuit board on which the semiconductor chip is mounted; a sealing resin including epoxy resin for sealing the semiconductor chip and the circuit board; and a reinforcing material, with a higher Young's modulus than the sealing resin, provided in close contact with the sealing resin above at least a part of the sealing resin. The semiconductor module includes a resin case for enclosing spaces for housing the semiconductor chip, wherein the sealing resin may be provided inside the resin case.
Claims18
A semiconductor module, comprising:
- a semiconductor chip;
- a circuit board on which the semiconductor chip is mounted;
- a sealing resin including epoxy resin for sealing the semiconductor chip and the circuit board;
- and
- a reinforcing material, with a higher Young's modulus than the sealing resin, provided in close contact with the sealing resin above at least a part of the sealing resin,
- wherein an area of the reinforcing material in a top view is smaller than an area of the sealing resin in a top view.
3 more elements
Dependencies are inferred from the claim text.