Integrated circuit packages with conductive element having cavities housing electrically connected embedded components

An integrated circuit (IC) structure, comprising:

• a package substrate having a first contact and a second contact on a surface and a conductive pathway electrically coupled to the second contact;
• a die electrically coupled to the surface of the package substrate;
• a conductive element having opposing first and second faces, wherein the first face of the conductive element has a recessed cavity, wherein the first face of the conductive element is electrically coupled to the package substrate via the first contact;
• and
• a component embedded in the recessed cavity of the conductive element and having a first terminal end electrically coupled to the die via the second contact and the conductive pathway in the package substrate, wherein the first terminal end is associated with a power reference voltage.

An integrated circuit (IC) structure, comprising:

• a package substrate having a first contact and a second contact on a surface and a conductive pathway electrically coupled to the second contact;
• a die electrically coupled to the surface of the package substrate;
• a conductive element having opposing first and second faces, wherein the first face of the conductive element has a recessed cavity, wherein the first face of the conductive element is electrically coupled to the package substrate via the first contact;
• and
• a component embedded in the recessed cavity of the conductive element and having a first terminal end electrically coupled to the die via the second contact and the conductive pathway in the package substrate, wherein the component is positioned vertically within the cavity of the conductive element with the first terminal end facing towards the surface of the package substrate.

An integrated circuit (IC) structure, comprising:

• a package substrate having a first contact and a second contact on a surface and a conductive pathway electrically coupled to the second contact;
• a die electrically coupled to the surface of the package substrate;
• a conductive element having opposing first and second faces, wherein the first face of the conductive element has a recessed cavity, wherein the first face of the conductive element is electrically coupled to the package substrate via the first contact;
• and
• a component embedded in the recessed cavity of the conductive element and having a first terminal end electrically coupled to the die via the second contact and the conductive pathway in the package substrate, wherein the component further comprises a second terminal end electrically coupled to the conductive element.

An integrated circuit (IC) package, comprising:

• a package substrate including a first contact, a second contact, and a third contact on a surface, and a conductive pathway electrically coupling the second contact and the third contact;
• a die electrically coupled to the third contact on the surface of the package substrate;
• a conductive element having opposing first and second faces, wherein the first face of the conductive element has a recessed cavity, and wherein the first face of the conductive element is electrically coupled to the package substrate via the first contact;
• and
• a component embedded in the recessed cavity of the conductive element and having a first terminal end electrically coupled to the die via the second contact and the conductive pathway in the package substrate.

A computing device, comprising:

• a circuit board;
• and
• an integrated circuit (IC) package electrically coupled to the circuit board, wherein the IC package comprises:
• a package substrate including a first contact, a second contact, and a third contact on a surface, and a conductive pathway electrically coupling the second contact and the third contact;
• a die electrically coupled to the third contact on the surface of the package substrate;
• a conductive stiffener having opposing first and second faces, wherein the first face of the conductive stiffener has a recessed cavity, and wherein the first face of the conductive stiffener is electrically coupled to the package substrate via the first contact;
• and
• a component embedded in the recessed cavity of the conductive stiffener and having a first terminal end electrically coupled to the die via the second contact and the conductive pathway in the package substrate.