Shielded radio-frequency devices
AssigneeSkyworks Solutions, Inc.
InventorPietro Natale Alessandro Chyurlia
Life of this patent
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Abstract
In some embodiments, a radio-frequency device can be manufactured by a method that includes forming or providing a substrate, fabricating or providing a flip chip die having a front side and a back side, and including an integrated circuit implemented on the front side, and mounting the front side of the flip chip die on the substrate. The method can further include implementing a shielding component over the back side of the flip chip die to provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.
Claims20
A method for manufacturing a radio-frequency device, the method comprising:
- forming or providing a substrate;
- fabricating or providing a flip chip die having a front side and a back side, and including an integrated circuit implemented on the front side;
- mounting the front side of the flip chip die on the substrate;
- forming a carrier wafer layer disposed over the back side of the flip chip die;
- forming a conductive layer disposed over the carrier wafer layer;
- and
- implementing a plurality of shielding wirebonds to provide an electrical connection between the conductive layer and a ground plane of the substrate, such that the conductive layer and the plurality of shielding wirebonds provide electromagnetic shielding between a first region within or on the flip chip die and a second region away from the flip chip die.
The method of claimer 1, wherein the plurality of shielding wirebonds are arranged partially or fully around the flip chip die.
A method for manufacturing a radio-frequency device, the method comprising:
- forming or providing a substrate;
- fabricating or providing a die having a front side and a back side, and including an integrated circuit implemented on the front side;
- mounting the front side of the die on the substrate;
- forming a carrier wafer layer disposed over the back side of the die;
- forming a conductive layer disposed over the carrier wafer layer;
- and
- implementing a plurality of shielding wirebonds to provide an electrical connection between the conductive layer and a ground plane of the substrate, such that the conductive layer and the plurality of shielding wirebonds provide electromagnetic shielding between a first region within or on the die and a second region away from the die.
Dependencies are inferred from the claim text.