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US 11,887,937 B2Granted
Reduction in susceptibility of analog integrated circuits and sensors to radio frequency interference
Assigneeams International AG
InventorsBenjamin Joseph Sheahan, Richard Jennings, Robert Allen Helmick, Marko Magerl, Christian Stockreiter
Life of this patent
Estimating the term…
Abstract
An apparatus comprises a ground plane (2), an integrated circuit chip (1) disposed on the ground plane (2), the integrated circuit chip (1) comprising one or more electrically conductive layers (10) encircling a periphery of the integrated circuit chip (1), and a plurality of bondwires (9) electrically coupling the one or more electrically conductive layers (10) to the ground plane (2).
Claims19
An apparatus comprising:
- a ground plane;
- an integrated circuit chip disposed on the ground plane, the integrated circuit chip comprising one or more electrically conductive layers encircling a periphery of the integrated circuit chip;
- and
- a plurality of bondwires electrically coupling the one or more electrically conductive layers to the ground plane.
1 more element
An apparatus comprising:
- an integrated circuit chip comprising one or more optical sensors and one or more electrically conductive layers encircling a periphery of the integrated circuit chip, a ground plane, a means for reducing radio frequency interference to one or more components of the integrated circuit chip, and a plurality of bondwires electrically coupling the one or more electrically conductive layers to the ground plane.
Dependencies are inferred from the claim text.