Semiconductor device and manufacturing method thereof

A semiconductor device manufacturing method comprising:

• forming a plurality of semiconductor devices from a semiconductor wafer;
• and
• identifying a position of one of the semiconductor devices within the semiconductor wafer,
• wherein the forming the plurality of semiconductor devices comprises:
• forming a first repeating pattern including i (i is an integer greater than or equal to 2) semiconductor devices each having a unique pattern;
• forming a second repeating pattern including j (j is an integer greater than or equal to 2) semiconductor devices each having a unique pattern;
• defining a plurality of semiconductor devices on the semiconductor wafer such that each of k>i, j) semiconductor devices has a unique pattern based on the first and second repeating patterns;
• and
• grinding a backside of the semiconductor wafer,
• wherein each unique pattern of the k semiconductor devices is composed of a combination of the unique patterns of the first and second repeating patterns, and
• wherein the position of the one of the semiconductor devices is identified based on the unique patterns of the first and second repeating patterns and an angle of a grinding mark of the semiconductor device.