Package structure with interposer encapsulated by an encapsulant
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYung-Shun Chang, Sheng-Wen Yang, Teck-Chong Lee, Yen-Liang Huang
Life of this patent
Estimating the term…
Abstract
A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.
Claims7
A package structure, comprising:
- an encapsulant having a top surface and a bottom surface opposite to the top surface;
- and an interposer encapsulated by the encapsulant, comprising:
- a main body having a first surface and a second surface opposite to the first surface;
- an interconnector disposed on the first surface and exposed from the top surface of the encapsulant;
- and
- a stop layer on the second surface, wherein a bottom surface of the stop layer is lower than the second surface;
- wherein the stop layer has a surface substantially aligned with the bottom surface of the encapsulant.
A package structure, comprising:
- an encapsulant having a top surface and a bottom surface opposite to the top surface;
- and
- an interposer encapsulated by the encapsulant, comprising:
- a main body having a first surface and a second surface opposite to the first surface;
- an interconnector disposed on the first surface and exposed from the top surface of the encapsulant;
- and
- a stop layer on the second surface, wherein a bottom surface of the stop layer is lower than the second surface;
- wherein a gap is between the stop layer and the second surface of the main body.
Dependencies are inferred from the claim text.