Method of producing semiconductor devices and corresponding semiconductor device
AssigneesSTMicroelectronics S.r.l., STMicroelectronics SDN BHD
InventorsAndrea Albertinetti, Marifi Corregidor Cagud
Life of this patent
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Abstract
A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.
Claims21
A method, comprising:
- attaching a semiconductor die onto an area of a substrate, wherein the semiconductor die comprises a warped semiconductor die having mutually opposed first and second surfaces, the first surface concave and the second surface convex;
- wherein attaching comprises:
- dispensing a first mass of die attach material having a first rheology onto said area;
- dispensing a second mass of die attach material having a second rheology different from the first rheology onto the first mass of die attach material;
- wherein the second mass of die attach material provides a raised formation of die attach material relative to the first mass of die attach material;
- wherein dispensing the second mass of die attach material comprises dispensing the second mass of die attach material centrally of the first mass of die attach material;
- and
- placing the warped semiconductor die onto the first and second mass of die attach material with the first concave surface of the warped semiconductor die facing the substrate having the die attach material dispensed thereon.
A method, comprising:
- attaching a semiconductor die onto an area of a substrate, wherein the semiconductor die comprises a warped semiconductor die having mutually opposed first and second surfaces, the first surface concave and the second surface convex;
- wherein attaching comprises:
- dispensing a first mass of die attach material having a first rheology onto said area;
- dispensing a second mass of die attach material having a second rheology different from the first rheology onto the first mass of die attach material;
- wherein the second mass of die attach material provides a raised formation of die attach material relative to the first mass of die attach material;
- wherein dispensing the second mass of die attach material comprises dispensing the second mass of die attach material peripherally of the first mass of die attach material;
- and
- placing the warped semiconductor die onto the first and second mass of die attach material with the second convex surface of the warped semiconductor die facing the substrate having the die attach material dispensed thereon.
Dependencies are inferred from the claim text.