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US 11,887,915 B2Granted
Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and a method of manufacturing a semiconductor device
AssigneeAmkor Technology Japan, Inc.
InventorMasafumi Suzuhara
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a die pad; a plurality of external connection terminals located around the die pad; a semiconductor chip located on a top surface of the die pad and electrically connected with the plurality of external connection terminals; and a sealing member covering the die pad, the plurality of external connection terminals and the semiconductor chip and exposing an outer terminal of each of the plurality of external connection terminals. A side surface of the outer terminal of each of the plurality of external connection terminals includes a first area, and the first area is plated.
Claims20
A semiconductor package comprising:
- a lead frame comprising a first external connection terminal, wherein the first external connection terminal comprises:
- a bottom end;
- an outer terminal portion comprising a side end;
- and
- an inner terminal portion opposite to and coupled to the outer terminal portion;
- a semiconductor device coupled to the first external connection terminal with a first interconnect;
- a sealing member covering the first external connection terminal and the semiconductor device and comprising a top side, a bottom side opposite to the bottom side, and a lateral side;
- a plating layer;
- and
- a groove extending inward from the bottom side of the sealing member adjoining the inner terminal portion;
- wherein:
- the bottom end of the first external connection terminal is exposed from the bottom side of the sealing member;
- the side end of the outer terminal portion is exposed from the sealing member;
- at least part of the inner terminal portion is exposed from the sealing member within the groove;
- the plating layer fully covers the side end of the outer terminal portion;
- and
- the first interconnect is the only internal attachment to the first external connection terminal.
14 more elements
A semiconductor package comprising:
- a lead frame comprising external connection terminals;
- a semiconductor device coupled to the external connection terminals with interconnects;
- a sealing member covering portions of the external connection terminals and the semiconductor device;
- and
- a plating structure;
- wherein:
- the external connection terminals comprise:
- bottom ends exposed from the sealing member;
- outer terminal portions having side ends exposed from the sealing member;
- and
- inner terminal portions opposite to and coupled to the outer terminal portions;
- the plating structure fully covers at least a top portion of the side ends;
- the external connection terminals are on at least two adjoining sides of the semiconductor device;
- the plating structure consists of a structure that is external to the sealing member so that the portions of the external connection terminals covered by the sealing member are devoid of the plating structure;
- the inner terminal portions comprise side ends;
- portions of the side ends of the inner terminal portions are exposed from the sealing member;
- and
- the portions of the side ends of the inner terminal portions that are exposed are devoid of the plating structure.
15 more elements
A semiconductor package comprising:
- a lead frame comprising external connection terminals, the external connection terminals comprise:
- bottom ends;
- outer terminal portions comprising side ends;
- and
- inner terminal portions coupled to the outer terminal portions;
- a semiconductor component coupled to the external connection terminals;
- a sealing member covering the external connection terminals and the semiconductor component and comprising a top side, a bottom side opposite to the top side, and a lateral side connecting the top side to the bottom side;
- a groove extending inward from the bottom side of the sealing member adjoining the inner terminal portions;
- and
- a plated conductor;
- wherein:
- the side ends of the outer terminal portions are exposed from the sealing member;
- the inner terminal portions are exposed from the sealing member within the groove;
- the plated conductor fully covers the side ends of the outer terminal portions;
- and
- the external connection terminals are on two adjoining sides of the semiconductor component.
13 more elements
Dependencies are inferred from the claim text.