Electronic power module
AssigneesCommissariat A L'energie Atomique Et Aux Energies Alternatives, Centre National De La Recherche Scientifique
InventorsKremena Vladimirova, Jean-Christophe Crebier, Julie Widiez
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Abstract
An electronic power module includes at least a semiconductor chip having at least one electronic power component and two metal layers between which the semiconductor chip is directly secured. At least a first of the two metal layers forms a redistribution layer having several distinct metal portions, each electrically connected to at least one electrical contact pad of the semiconductor chip, and/or at least one second of the two metal layers includes at least one first structured face arranged against the semiconductor chip and having at least one pad formed in a part of its thickness.
Claims14
A power electronic module including:
- at least one semiconductor chip comprising at least one power electronic component;
- at least two metal layers between which the at least one semiconductor chip is directly secured, wherein at least a first of the at least two metal layers includes at least one first structured face disposed against the at least one semiconductor chip and comprising at least one pad formed in part of a thickness thereof;
- and
- a first metallised support to which the at least the first of the at least two metal layers is secured by a first layer of solder.
A power electronic module including:
- at least one semiconductor chip comprising at least one power electronic component;
- and
- at least two metal layers between which said at least one semiconductor chip is directly secured, wherein at least a first of said at least two metal layers forms a redistribution layer comprising a plurality of distinct metal portions each electrically connected to at least one electrical contact pad of said at least one semiconductor chip.
Dependencies are inferred from the claim text.