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US 11,887,908 B2Granted
Electronic package structure with offset stacked chips and top and bottom side cooling lid
AssigneeInternational Business Machines Corporation
InventorsKamal K. Sikka, Katsuyuki Sakuma, Hilton T. Toy, Shidong Li, Ravi K Bonam
Life of this patent
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Abstract
An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.
Claims20
An electronic structure comprising:
- three-dimensional chips arranged in a stack, wherein at least one chip of the three-dimensional chips is offset by at least one distance relative to another chip of the stack such that the at least one chip has an exposed surface not covered with the another chip;
- and
- a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips;
- wherein at least one ledge of at least one piece of the two-piece lid structure covers the exposed surface, and a thermal interface material is applied between the at least one ledge of the at least one piece of the two-piece lid structure and the exposed surface.
1 more element
Dependencies are inferred from the claim text.