Method of manufacturing semiconductor device including cutting a molding member and a redistribution wiring layer and a cutting region of a base substrate

A method of manufacturing a semiconductor device, the method comprising:

• forming a redistribution wiring layer, which includes a plurality of redistribution wirings, on a base substrate, the base substrate including a package region and a cutting region surrounding the package region;
• mounting a semiconductor chip on the redistribution wiring layer in the package region of the base substrate, the semiconductor chip having a first surface that is an active surface, a second surface opposite to the first surface, and first, second, third, and fourth side surfaces each extending between the first surface and the second surface of the semiconductor chip, the first and second side surfaces of the semiconductor chip extending in a first direction and being disposed opposite to each other, and the third and fourth side surfaces of the semiconductor chip extending in a second direction and being disposed opposite to each other, the semiconductor chip having chip pads at the first surface of the semiconductor chip and electrically connected to the plurality of redistribution wirings;
• forming a molding member on the redistribution wiring layer and covering the semiconductor chip;
• arranging outer connection members in a connection region of the redistribution wiring layer that is defined on an outer surface of the redistribution wiring layer, the outer connection members being electrically connected to the plurality of redistribution wirings;
• and
• cutting the molding member and the redistribution wiring layer along the cutting region of the base substrate such that the molding member exposes the first side surface and the second side surface of the semiconductor chip and surrounds the third side surface and the fourth side surface of the semiconductor chip.