Packaged device with die wrapped by a substrate
AssigneeTexas Instruments Incorporated
InventorSreenivasan K. Koduri
Life of this patent
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Abstract
A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.
Claims23
A method for forming a die-wrapped packaged device, comprising:
- placing a die comprising substrate having a back side and a top side semiconductor surface including circuitry thereon having nodes coupled to bond pads with its one of its sides onto a top side of at least one flexible substrate, wherein the flexible substrate further comprises a bottom side that has lead terminals, wherein the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals, and
- wrapping the flexible substrate over the die, wherein the flexible substrate has a sufficient length relative to the die so that the flexible substrate extends over at least two sidewalls of the die and onto the top side of the die,
- wherein the die bonding features are positioned so that after the wrapping they match the positions of the bond pads so that the die bonding features reached the top side of the die and are over the bond pads, and
- wherein the flexible substrate comprises a glass-reinforced epoxy laminate material, a paper, or a dielectric metal comprising foil.
A method, comprising:
- providing a semiconductor die comprising a substrate having a back side and a top side semiconductor surface including circuitry thereon having nodes coupled to bond pads;
- and
- providing a flexible substrate having a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the die and bonding features on the flexible substrate contact the bond pads, wherein the flexible substrate comprises a glass-reinforced epoxy laminate material, a paper, or a dielectric metal comprising foil.
A method, comprising:
- providing at least one flexible substrate having a top side and a bottom side that has lead terminals, wherein the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals, and
- at least one die comprising a substrate having a back side and a top side semiconductor surface including circuitry thereon having nodes coupled to bond pads,
- wherein one of the sides of the die is mounted on the top side of the flexible circuit,
- wherein the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the die and so that the die bonding features contact the bond pads, and
- wherein the flexible substrate comprises a glass-reinforced epoxy laminate material, a paper, or a dielectric metal comprising foil.
A method, comprising:
- providing a semiconductor die comprising a substrate having a back side and a top side semiconductor surface including circuitry thereon having nodes coupled to bond pads;
- providing a first flexible substrate having a sufficient length relative to the die so that the flexible substrate wraps to extend over a first sidewall of the die onto the top side of the die;
- providing a second flexible substrate having a sufficient length relative to the die so that the flexible substrate wraps to extend over a second sidewall of the die onto the top side of the die;
- providing a third flexible substrate having a sufficient length relative to the die so that the flexible substrate wraps to extend over a third sidewall of the die onto the top side of the die;
- and
- bonding features on the first, second and third flexible substrates to the bond pads.
A method, comprising:
- providing a semiconductor die comprising a substrate having a back side and a top side semiconductor surface including circuitry thereon having nodes coupled to bond pads;
- providing at least three flexible substrates each having a sufficient length relative to the die so that each flexible substrate wraps to extend over a respective sidewall of the die onto the top side of the die;
- and
- bonding features on the three flexible substrates to the bond pads.
Dependencies are inferred from the claim text.