Repairing method for micro-LED chip defective pixels

A repairing method for repairing micro-LED chip defective pixel, comprising steps of:

• providing a substrate, wherein a plurality of sub-pixel areas are provided on the substrate, each of the sub-pixel areas is provided with two recesses, and the two recesses are respectively a main recess and a backup recess;
• transferring a plurality of main micro-LED chips to the substrate by a fluid mass transfer method, so that the main recess in each of the sub-pixel areas is loaded with one of the main micro-LED chips;
• detecting all of the main micro-LED chips to find the sub-pixel area with a defective pixel;
• and
• transferring a plurality of backup micro-LED chips to the substrate by a fluid mass transfer method, so that the backup recess in each of the sub-pixel areas where the defective pixel is detected is loaded with one of the backup micro-LED chips, wherein
• colors of the light emitted by the backup micro-LED chips and the main Micro-LED chips in the same sub-pixel area are the same, and the color is red, green or blue;
• wherein
• a bottom of each of the main recesses and a bottom of each of the backup recesses are provided with two electrodes, respectively, the two electrodes in the main recess are electrically connected to a first welding circuit, and the two electrodes in the backup recess are electrically connected to a second welding circuit;
• wherein
• the step of “detecting all of the main micro-LED chips to find the sub-pixel area with a defective pixel” includes steps of:
• energizing the first welding circuit to bond the two electrodes in each of the main recesses to the loaded main micro-LED chips;
• and
• detecting all of the main micro-LED chips based on an ultraviolet detection method or a micro-LED chip photoelectric characteristic detection method to find out the sub-pixel area with the defective pixel;
• wherein
• after the step of “transferring a plurality of backup micro-LED chips to the substrate by a fluid mass transfer method, so that the backup recess in each of the sub-pixel areas where the defective pixel is detected is loaded with one of the backup micro-LED chips”, the repairing method further comprises a step of:
• energizing the second welding circuit, so that the two electrodes in the backup recess in each of the sub-pixel areas where the defective pixel is detected are bonded to the loaded backup micro-LED chips.