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US 11,887,879 B2Granted
In-situ apparatus for semiconductor process module
AssigneeApplied Materials, Inc.
InventorsYogananda Sarode Vishwanath, Steven E. Babayan, Stephen Prouty, Andreas Schmid
Life of this patent
Estimating the term…
Abstract
Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.
Claims20
A carrier for supporting an edge ring, comprising:
- a plate having a perimeter including a plurality of curved edges and a plurality of parallel edges;
- a plurality of inserts disposed in the plate, each insert formed of a polymer material and configured to engage a supporting structure;
- and
- a plurality of support structures coupled to the plurality of curved edges, each respective support structure extending above a plane of an upper surface of the plate, and each respective support structure comprising:
- a step formed on a radially outward edge of the respective support structure and disposed above and below the plane of the upper surface of the plate, the step of each respective support structure comprising:
- a supporting surface disposed parallel to and below the upper surface of the plate, and
- an arcuate wall positioned radially inward of the supporting surface of the respective support structure and oriented perpendicular to and extending above the plane of the upper surface of the plate, the arcuate wall of each respective support structure extending perpendicularly to the supporting surface of the respective support structure, and
- a male extension positioned radially inward of the wall and extending into the plate.
5 more elements
A carrier for supporting an edge ring, comprising:
- a plate having a perimeter including a plurality of curved edges and a plurality of parallel edges;
- a plurality of inserts disposed in the plate, each insert formed of a polymer material and configured to engage a supporting structure;
- and
- a plurality of support structures coupled to the plurality of curved edges, each respective support structure comprising:
- a step formed on a radially outward edge of the respective support structure, the step of each respective support structure comprising:
- a supporting surface, and
- an arcuate wall positioned radially inward of the supporting surface of the respective support structure and extending perpendicularly to the supporting surface of the respective support structure.
4 more elements
A method of transferring an edge ring, comprising:
- inserting a robot blade into a chamber through a slit valve door, the robot blade having a carrier thereon and an edge ring supported on the carrier;
- positioning the carrier and the edge ring thereon over a substrate support;
- actuating substrate lift pins to lift the edge ring from the carrier;
- and
- retracting the robot blade and the carrier from the chamber;
- wherein the carrier comprises:
- a plate having a perimeter including a plurality of curved edges and a plurality of parallel edges;
- a plurality of inserts disposed in the plate, each insert formed of a polymer material and configured to engage a supporting structure;
- and
- a plurality of support structures coupled to the plurality of curved edges, each respective support structure comprising:
- a step formed on a radially outward edge of the respective support structure, the step of each respective support structure comprising:
- a supporting surface, and
- an arcuate wall positioned radially inward of the supporting surface of the respective support structure and extending perpendicularly to the supporting surface of the respective support structure.
10 more elements
Dependencies are inferred from the claim text.