Electrostatic chuck device
AssigneeSumitomo Osaka Cement Co., Ltd.
InventorsMamoru Kosakai, Masaki Ozaki, Keisuke Maeda
Life of this patent
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Abstract
An electrostatic chuck device includes: an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the electrostatic chuck part has a recess and protrusion on the adhesive layer side, and a sheet resistance value of the first electrode is higher than 1.0Ω/□ and lower than 1.0×1010Ω/□.
Claims10
An electrostatic chuck device comprising:
- an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction;
- a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part;
- and
- an adhesive layer that bonds the electrostatic chuck part and the cooling base part together,
- wherein the electrostatic chuck part has a recess on the adhesive layer side,
- the cooling base part has a protrusion on the adhesion layer side,
- a sheet resistance value of the first electrode is higher than 1.0Ω/□ and lower than 1.0×1010Ω/□, and
- the adhesion layer is provided along the recess and protrusion.
Dependencies are inferred from the claim text.