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US 11,887,866 B2Granted
Supercritical processing apparatus
AssigneeSemes Co., Ltd.
InventorsJae Seong Lee, Hae Won Choi, Ki Hoon Choi, Anton Koriakin, Chan Young Heo, Do Heon Kim, Ji Soo Jeon
Life of this patent
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Abstract
A supercritical processing apparatus includes an upper vessel including a first fluid hole formed in a center thereof, and a lower vessel including a second fluid hole formed in a center thereof. A space is defined between the upper and lower vessels and configured to allow a substrate to be placed therein. The upper vessel further includes a first guide portion provided at a lower portion thereof to be gradually inclined downward toward a periphery thereof from the first fluid hole.
Claims13
A supercritical processing apparatus for processing a substrate using a supercritical fluid, comprising:
- a vessel comprised of an upper vessel including a first fluid hole formed in a center thereof, and a lower vessel including a second fluid hole formed in a center thereof, wherein the supercritical fluid flows via the first fluid hole and the second fluid hole;
- and
- a space defined between a lower surface of the upper vessel and an upper surface of lower vessel and configured to allow the substrate to be placed therein,
- wherein the upper vessel further includes a first guide portion provided at a lower portion thereof to be gradually inclined downward toward a periphery thereof from the first fluid hole,
- wherein the supercritical fluid flows along the first guide portion,
- wherein the lower surface of the upper vessel includes a first lower horizontal surface, a second lower horizontal surface, and a vertical side surface connecting the first horizontal lower surface to the second lower horizontal surface, wherein the second lower horizontal surface of the upper vessel is lower than the first lower horizontal surface of the upper vessel,
- wherein a portion of an interior surface of the upper and lower vessels that are engaged with each other is an uppermost upper horizontal surface of the lower vessel and is lower than the second lower horizontal surface of the upper vessel, and
- wherein the first lower horizontal surface, the second lower horizontal surface and the vertical side surface connected with other to form a first stepped portion of the upper vessel, and
- wherein when viewed in a plan view, the vertical side surface is located outside of a periphery of the substrate.
6 more elements
A supercritical processing apparatus for processing a substrate using a supercritical fluid, comprising:
- a vessel comprised of an upper vessel including a first fluid hole formed in a center thereof, and a lower vessel including a second fluid hole formed in a center thereof, wherein the supercritical fluid flows via the first fluid hole and the second fluid hole;
- and
- a space defined between a lower surface of the upper vessel and an upper surface of the lower vessel and configured to allow the substrate to be placed therein,
- wherein the lower vessel further includes a second guide portion provided at an upper portion thereof to be gradually inclined upward toward a periphery thereof from the second fluid hole,
- wherein the supercritical fluid flows along the second guide portion,
- wherein the lower surface of the upper vessel includes a first lower horizontal surface, a second lower horizontal surface, and a vertical side surface connecting the first horizontal lower surface to the second lower horizontal surface,
- wherein the second lower horizontal surface of the upper vessel is lower than the first lower horizontal surface of the upper vessel,
- wherein a portion of an interior surface of the upper and lower vessels that are engaged with each other is an uppermost upper horizontal surface of the lower vessel and is lower than the second lower horizontal surface of the upper vessel,
- wherein the first lower horizontal surface, the second lower horizontal surface and the vertical side surface connected with other to form a first stepped portion of the upper vessel, and
- wherein when viewed in a plan view, the vertical side surface is located outside of a periphery of the substrate.
7 more elements
A supercritical processing apparatus for processing a substrate using a supercritical fluid, comprising:
- a vessel comprised of an upper vessel including a first fluid hole formed in a center thereof, and a lower vessel including a second fluid hole formed in a center thereof, wherein the supercritical fluid flows via the first fluid hole and the second fluid hole;
- and
- a space defined between a lower surface of the upper vessel and an upper surface of the lower vessel and configured to allow the substrate to be placed therein,
- wherein the upper vessel further includes a first guide portion provided at a lower portion thereof to be gradually inclined downward toward a periphery thereof from the first fluid hole, the supercritical fluid flowing along the first guide portion,
- wherein the lower vessel further includes a second guide portion provided at an upper portion thereof to be gradually inclined upward toward a periphery thereof from the second fluid hole, the supercritical fluid flowing along the second guide portion,
- wherein the first fluid hole is vertically aligned with the second fluid hole,
- wherein the lower surface of the upper vessel includes a first lower horizontal surface, a second lower horizontal surface, and a vertical side surface connecting the first horizontal lower surface to the second lower horizontal surface,
- wherein the second lower horizontal surface of the upper vessel is lower than the first lower horizontal surface of the upper vessel,
- wherein a portion of an interior surface of the upper and lower vessels that are engaged with each other is an uppermost upper horizontal surface of the lower vessel and is lower than the second lower horizontal surface of the upper vessel,
- wherein the first lower horizontal surface, the second lower horizontal surface and the vertical side surface connected with other to form a first stepped portion of the upper vessel, and
- wherein when viewed in a plan view, the vertical side surface is located outside of a periphery of the substrate.
8 more elements
Dependencies are inferred from the claim text.