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US 11,887,865 B2Granted
System and method for manufacturing a semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChenghan She
Life of this patent
Estimating the term…
Abstract
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.
Claims19
A method for manufacturing a semiconductor package structure, comprising:
- providing a carrier and a semiconductor device disposed on the carrier;
- dispensing a first molding powder having a first amount on a first region of the carrier;
- controlling a second amount of a second molding powder, according to a result of weighing the second molding powder, after dispensing the first molding powder;
- and
- dispensing the second molding powder on a second region of the carrier distinct from the first region of the carrier after controlling the second amount of the second molding powder.
2 more elements
A method for manufacturing a semiconductor package structure, comprising:
- providing a carrier and a semiconductor device disposed on the carrier;
- weighing a first molding powder;
- adjusting an amount of the first molding powder before dispensing the first molding powder on the carrier;
- and
- dispensing the first molding powder on the carrier after weighing the first molding powder.
2 more elements
A method for manufacturing a semiconductor package structure, comprising:
- providing a carrier and a semiconductor device disposed on the carrier;
- weighing a first molding powder;
- dispensing the first molding powder on the carrier after weighing the first molding powder;
- weighing a second molding powder after dispensing the first molding powder on the carrier;
- and
- dispensing the second molding powder on the carrier after weighing the second molding powder.
3 more elements
Dependencies are inferred from the claim text.