Double-sided partial molded SIP module

A method of making a semiconductor device, comprising:

• providing a substrate;
• disposing a first component and a board-to-board (B2B) connector over a first surface of the substrate;
• depositing a first encapsulant over the first component while the B2B connector remains outside of the first encapsulant;
• forming a shielding layer over the first encapsulant while the B2B connector remains outside of the first encapsulant;
• depositing a second encapsulant over a second surface of the substrate opposite the first surface;
• and
• forming a solder bump through the second encapsulant.

A method of making a semiconductor device, comprising:

• providing a substrate;
• disposing a first component over a first surface of the substrate;
• disposing a board-to-board (B2B) connector over the first surface of the substrate;
• depositing a first encapsulant over the first component;
• forming a shielding layer over the first encapsulant;
• disposing a solder bump over a second surface of the substrate opposite the first surface;
• depositing a second encapsulant over the second surface of the substrate;
• forming an opening through the second encapsulant to expose the solder bump;
• disposing a solder ball in the opening;
• and
• reflowing the solder ball and solder bump into a combined solder bump.

A method of making a semiconductor device, comprising:

• providing a substrate;
• disposing a first component over a first surface of the substrate;
• disposing a board-to-board (B2B) connector over the first surface of the substrate;
• depositing a first encapsulant over the first component;
• forming a shielding layer over the first encapsulant;
• disposing a solder bump over a second surface of the substrate;
• depositing a second encapsulant over the solder bump;
• forming an opening through the second encapsulant to expose the solder bump;
• disposing a solder ball in the opening;
• and
• reflowing the solder ball and solder bump into a combined solder bump.