Mid-processing removal of semiconductor fins during fabrication of integrated circuit structures
AssigneeIntel Corporation
InventorsMehmet O. Baykan, Anurag Jain, Szuya S. Liao
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AssigneeIntel Corporation
InventorsMehmet O. Baykan, Anurag Jain, Szuya S. Liao
Estimating the term…
Techniques are disclosed for forming integrated circuit structures having a plurality of semiconductor fins, which in turn can be used to form non-planar transistor structures. The techniques include a mid-process removal of one or more partially-formed fins. The resulting integrated circuit structure includes a plurality of semiconductor fins having relatively uniform dimensions (e.g., fin width and trough depth). In an embodiment, the fin forming procedure includes partially forming a plurality of fins, using a selective etch stop built into the semiconductor structure in which the fins are being formed. One or more of the partially-formed fins are removed via sacrificial fin cut mask layer(s). After fin removal, the process continues by further etching trenches between the partially-formed fins (deep etch) to form portion of fins that will ultimately include transistor channel portion. A liner material may be deposited to protect the partially-formed fins during this subsequent deep trench etch.
An integrated circuit comprising:
Dependencies are inferred from the claim text.