Method of forming carbon layer and method of forming interconnect structure
AssigneeSamsung Electronics Co., Ltd.
InventorsHyeonjin Shin, Keunwook Shin
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Abstract
Provided are a method of forming a carbon layer and a method of forming an interconnect structure. The method of forming a carbon layer includes providing a substrate including first and second material layers, forming a surface treatment layer on at least one of the first and second material layers, and selectively forming a carbon layer on one of the first material layer and the second material layer. The carbon layer has an sp2 bonding structure.
Claims25
A method of forming a carbon layer, the method comprising:
- providing a substrate including a first material layer and a second material layer;
- forming a surface treatment layer on at least one of the first material layer and the second material layer;
- and
- selectively forming a carbon layer on a portion of the surface treatment layer on the at least one of the first material layer and the second material layer, the carbon layer having an sp2 bonding structure.
A method of forming an interconnect structure, the method comprising:
- providing a substrate including a first metal layer and a first insulating layer;
- forming a surface treatment layer on at least one of the first metal layer and the first insulating layer;
- and
- selectively forming a carbon layer on the first metal layer, the carbon layer having an sp2 bonding structure;
- selectively forming a second insulating layer on the first insulating layer;
- forming a third insulating layer to cover the second insulating layer;
- and
- forming a second metal layer after the forming the third insulating layer, the second metal layer being electrically connected to the first metal layer.
A method of forming a carbon layer, the method comprising:
- forming a surface treatment layer on a substrate, the substrate including a first material layer and a second material layer, a material of the first material layer being different than a material of the second material layer, the surface treatment layer on the first material layer;
- and
- selectively forming a carbon layer on the surface treatment layer on the first material layer and not the second material layer, the carbon layer having an sp2 bonding structure.
Dependencies are inferred from the claim text.