Back to results
US 11,887,849 B2Granted
Method of forming transition metal dichalcogenidethin film and method of manufacturing electronic device including the same
AssigneesSamsung Electronics Co., Ltd., Research & Business Foundation Sungkyunkwan University
InventorsChanghyun Kim, Sangwoo Kim, Kyung-Eun Byun, Hyeonjin Shin, Ahrum Sohn, Jaehwan Jung
Life of this patent
Estimating the term…
Abstract
Disclosed herein are a method of forming a transition metal dichalcogenide thin film and a method of manufacturing a device including the same. The method of forming a transition metal dichalcogenide thin film includes: depositing a transition metal dichalcogenide thin film on a substrate; and heat-treating the deposited transition metal dichalcogenide thin film.
Claims19
A method of forming a thin film of transition metal dichalcogenide, the method comprising:
- providing a substrate in a reaction chamber;
- depositing a transition metal dichalcogenide thin film on the substrate using a sputtering process that uses a precursor and is performed at a first temperature,
- the precursor including a transition metal and a chalcogen;
- and
- heat-treating the transition metal dichalcogenide thin film on the substrate at a second temperature under a chalcogen atmosphere, the second temperature being higher than the first temperature, wherein
- the precursor includes a metal oxide, a metal halide, a metal carbonyl compound, or a combination thereof, and
- the heat-treating the transition metal dichalcogenide thin film includes forming the chalcogen atmosphere by providing a chalcogen-containing gas comprising at least one of H2S, H2Se or H2Te.
4 more elements
Dependencies are inferred from the claim text.