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US 11,887,846 B2Granted
Deposition tool and method for depositing metal oxide films on organic materials
AssigneeLam Research Corporation
InventorsAkhil Singhal, Patrick Van Cleemput
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Abstract
An Atomic Layer Deposition (ALD) method to deposit a metal oxide layer onto an organic photoresist on a substrate using a highly reactive organic metal precursor. The deposition method protects the organic photoresist from loss and degradation from exposure to oxygen species during subsequent ALD cycles. The organic metal precursor may be an amino type precursor or a methoxy type precursor.
Claims24
A method, comprising:
- depositing a metal layer onto an organic photoresist on a substrate using an organic metal precursor during a first half of an Atomic Layer Deposition (ALD) cycle;
- and
- exposing the substrate with the metal layer deposited onto the organic photoresist to an oxygen species during a second half of the ALD cycle to form a deposited metal oxide layer,
- wherein the organic metal precursor is sufficiently reactive to seal the organic photoresist with the deposited metal oxide layer from degradation by the oxygen species within three of the ALD cycles or less.
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A multi-patterning method performed on a substrate, the method comprising:
- using photolithography to pattern an organic photoresist to define mandrels on the substrate;
- depositing a layer of metal oxide over the mandrels on the substrate using an organic metal precursor;
- and
- forming metal oxide spacers on the organic photoresist on the substrate by removing substantially horizontal surfaces of the layer of the metal oxide and the mandrels from the substrate;
- wherein depositing the layer of metal oxide comprises performing three or fewer Atomic Layer Deposition (ALD) cycles on the substrate.
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Dependencies are inferred from the claim text.