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US 11,887,839 B2Granted
Imaging unit and imaging apparatus
AssigneeNikon Corporation
InventorsHirofumi Arima, Ryoichi Suganuma, Takuya Sato, Satoru Suzuki
Life of this patent
Estimating the term…
Abstract
An imaging unit comprising an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside. An imaging apparatus comprises an imaging unit that includes an imaging chip and a mounting substrate that has the imaging chip mounted thereon and includes a first metal layer for outputting a signal generated by the imaging chip to the outside.
Claims36
An imaging unit comprising:
- a first substrate that includes a first surface and a second surface, the second surface facing away from the first surface;
- an imaging chip that (i) outputs a pixel signal and (ii) is arranged on the first surface;
- a member that is arranged on the first surface so as to surround at least part of the imaging chip and that includes an attaching portion for attaching another structure;
- an optical element that is fixed to the member so as to form a sealed space together with the substrate and the member;
- a power supply circuit that (i) supplies power to the imaging chip, (ii) is arranged on the second surface, and (iii) is located in an area underneath the imaging chip so as to be overlapped by the imaging chip in plan view from a direction in which light is incident to the imaging chip;
- a connector that is arranged on the second surface;
- a second, flexible substrate that is connected to the connector;
- and
- a third substrate that includes an image processing circuit to which the pixel signal output from the imaging chip is transmitted through the connector and the flexible substrate.
6 more elements
An imaging unit comprising:
- a first substrate that includes a first surface and a second surface, the second surface facing away from the first surface;
- an imaging chip that (i) outputs a pixel signal and (ii) is arranged on the first surface;
- a member that is arranged on the first surface so as to surround at least part of the imaging chip and that includes an attaching portion for attaching another structure;
- an optical element that is fixed to the member so as to form a sealed space together with the substrate and the member;
- an electronic component that (i) forms at least a part of a power supply circuit that supplies power to the imaging chip, (ii) is arranged on the second surface, and (iii) is located in an area underneath the imaging chip so as to be overlapped by the imaging chip in plan view from a direction in which light is incident to the imaging chip;
- a connector that is arranged on the second surface and is for outputting an image signal of the subject imaged by the imaging chip;
- a second, flexible substrate that is connected to the connector;
- and
- a third substrate that includes an image processing circuit to which the pixel signal output from the imaging chip is transmitted through the connector and the flexible substrate.
6 more elements
Dependencies are inferred from the claim text.