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US 11,887,826 B2Granted
Semiconductor manufacturing apparatus and earth shield
AssigneeKioxia Corporation
InventorsTakashi Izumi, Akitsugu Hatazaki
Life of this patent
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Abstract
A semiconductor manufacturing apparatus according to an embodiment includes a stage, a backing plate and an earth shield. The stage is configured to hold a substrate that a film is to be deposited on. The backing plate faces the stage and is configured such that a target containing a film deposition material is to be joined. The earth shield has an opening configured to enclose the target, and a plurality of through holes provided over a whole circumference of a circumferential part of the opening.
Claims2
A plasma sputtering apparatus comprising:
- a stage configured to hold a substrate that a film is to be deposited on;
- a backing plate facing the stage and configured such that a target containing an insulating film deposition material is to be joined;
- an earth shield having an opening configured to enclose the target, and a plurality of through holes provided over a whole circumference of a circumferential part of the opening;
- a cooling channel provided on an upper surface of the backing plate;
- and
- a magnet provided in the cooling channel, wherein
- the plurality of through holes extend in an oblique inward to a bottom surface of the earth shield, and
- an aperture diameter of the plurality of through holes is larger than a distance between the target and the opening.
5 more elements
Dependencies are inferred from the claim text.