Method of cleaning plasma processing apparatus and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorsYasutaka Hama, Nobuaki Shindo
Life of this patent
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Abstract
A method of cleaning a plasma processing apparatus includes: disposing a first dummy substrate at a first position with respect to a stage inside a chamber and performing a first dry cleaning process inside the chamber; and disposing a second dummy substrate at a second position with respect to the stage inside the chamber and performing a second dry cleaning process inside the chamber, wherein each of a center of the first position and a center of the second position is located at a different position from a center of the stage in a plan view, and wherein the first position and the second position are different from each other in a plan view.
Claims19
A method of cleaning a plasma processing apparatus, the method comprising:
- disposing a first dummy substrate at a first position with respect to a stage inside a chamber and performing a first dry cleaning process of cleaning an inside of the chamber with the first dummy substrate disposed at the first position;
- and
- disposing a second dummy substrate at a second position with respect to the stage inside the chamber and performing a second dry cleaning process of cleaning the inside of the chamber with the second dummy substrate disposed at the second position,
- wherein each of a center of the first position and a center of the second position is located at a different position from a center of the stage in a plan view, and
- wherein the first position and the second position are different from each other in a plan view.
A plasma processing apparatus, comprising:
- a chamber;
- a stage provided inside the chamber and configured to mount a first dummy substrate or a second dummy substrate on the stage;
- a dry cleaning part configured to dry-clean an interior of the chamber;
- and
- a controller configured to control the dry cleaning part,
- wherein the controller controls the dry cleaning part so as to perform:
- disposing the first dummy substrate at a first position with respect to the stage inside the chamber and performing a first dry cleaning process of cleaning an inside of the chamber with the first dummy substrate disposed at the first position;
- and disposing the second dummy substrate at a second position with respect to the stage inside the chamber and performing a second dry cleaning process of cleaning the inside of the chamber with the second dummy substrate disposed at the second position,
- wherein each of a center of the first position and a center of the second position is located at a different position from a center of the stage in a plan view, and
- wherein the first position and the second position are different from each other in a plan view.
Dependencies are inferred from the claim text.