Semiconductor processing chambers for deposition and etch
AssigneeApplied Materials, Inc.
InventorsKhokan Chandra Paul, Ravikumar Patil
Life of this patent
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Abstract
Exemplary semiconductor substrate supports may include a pedestal having a shaft and a platen. The semiconductor substrate supports may include a cover plate. The cover plate may be coupled with the platen along a first surface of the cover plate. The cover plate may define a recessed channel in a second surface of the cover plate opposite the first surface. The semiconductor substrate supports may include a puck coupled with the second surface of the cover plate. The puck may incorporate an electrode. The puck may define a plurality of apertures extending vertically through the puck to fluidly access the recessed channel defined in the cover plate.
Claims20
A semiconductor substrate support comprising:
- a pedestal having a shaft and a platen;
- a cover plate, wherein:
- the cover plate is coupled with the platen along a first surface of the cover plate;
- the cover plate defines a recessed channel in a second surface of the cover plate opposite the first surface, wherein the recessed channel is annular;
- the cover plate defines at least one lateral channel that is disposed at a depth within the cover plate that is between a bottom surface of the recessed channel and the first surface;
- and
- the cover plate defines a plurality of apertures that fluidly couple the at least one lateral channel with discrete portions of the recessed channel;
- and
- a puck coupled with the second surface of the cover plate, the puck incorporating an electrode, wherein the puck defines a plurality of apertures extending vertically through the puck to fluidly access the recessed channel defined in the cover plate.
A semiconductor processing system comprising:
- a chamber body;
- a substrate support configured to support a semiconductor substrate, wherein the substrate support comprises:
- a pedestal having a shaft and a platen;
- a cover plate, wherein:
- the cover plate is coupled with the platen along a first surface of the cover plate;
- the cover plate defines a recessed channel in a second surface of the cover plate opposite the first surface;
- the cover plate defines at least one lateral channel that is disposed at a depth within the cover plate that is between a bottom surface of the recessed channel and the first surface;
- and
- the cover plate defines a plurality of apertures that fluidly couple the at least one lateral channel with discrete portions of the recessed channel;
- and
- a puck coupled with the second surface of the cover plate, the puck incorporating an electrode, wherein the puck defines a plurality of apertures extending vertically through the puck to fluidly access the recessed channel defined in the cover plate;
- a faceplate, wherein the chamber body, the substrate support, and the faceplate define a processing region;
- a high-frequency plasma source coupled with the faceplate;
- and
- a low-frequency plasma source coupled with the substrate support.
Dependencies are inferred from the claim text.