Multilayer ceramic electronic component including metal terminals with recess portions and mounting structure of the multilayer ceramic electronic component

A multilayer ceramic electronic component comprising:

• a multilayer ceramic electronic component main body including a multilayer body, a first external electrode, and a second external electrode, the multilayer body including a plurality of laminated dielectric layers and a plurality of laminated internal electrode layers, and further including a first main surface and a second main surface opposed to each other in a height direction, a first side surface and a second side surface opposed to each other in a width direction orthogonal or substantially orthogonal to the height direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal or substantially orthogonal to the height direction and the width direction, the first external electrode being in a vicinity of the first end surface, and the second external electrode being in a vicinity of the second end surface;
• a first metal terminal connected to the first external electrode via a bonding material;
• and
• a second metal terminal connected to the second external electrode via a bonding material;
• wherein
• the first metal terminal includes a first terminal main body, and a first plating film on a surface of the first terminal main body;
• the second metal terminal includes a second terminal main body, and a second plating film on a surface of the second terminal main body;
• the first metal terminal includes a surface connected to the first external electrode on which a first recess portion is provided such that the first terminal main body is exposed in the first recess portion;
• the second metal terminal includes a surface connected to the second external electrode on which a second recess portion is provided such that the second terminal main body is exposed in the second recess portion;
• the surface on which the first recess portion is provided faces the first external electrode;
• the surface on which the second recess portion is provided faces the second external electrode;
• the first recess portion and the second recess portion each include cavities;
• an exterior material covers the multilayer ceramic electronic component main body, the bonding material, a portion of the first metal terminal, and a portion of the second metal terminal;
• the first plating film is provided on a portion of the surface on which the first recess portion is provided;
• and
• the second plating film is provided on a portion of the surface on which the second recess portion is provided.