Adhesive composition and coupling structure
OwnerTomoki Morijiri, Kengo Shinohara +1inventors
InventorsTomoki Morijiri, Kengo Shinohara, Ayao Matsukawa
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Abstract
A connected structure including: a first circuit member having a first electrode; a second circuit member having a second electrode; and a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other, wherein at least one of the first electrode and the second electrode has a layer made of Cu or Ag as an outermost surface thereof, and the connecting portion contains a conductive particle having a layer made of Pd or Au as an outermost surface thereof.
Claims7
A connected structure comprising:
- a first circuit member comprising a first electrode;
- a second circuit member comprising a second electrode;
- and
- a connecting portion provided between the first circuit member and the second circuit member and electrically connecting the first electrode and the second electrode to each other,
- wherein at least one of the first electrode and the second electrode comprises an outermost surface layer made of Cu,
- wherein the connecting portion comprises a conductive particle comprising an outermost surface layer made of Pd or Au, and
- wherein the outermost surface layer of the conductive particle has a thickness of 50 nm or less.
An adhesive composition comprising:
- an adhesive component;
- and
- a conductive particle,
- wherein the adhesive composition is used for bonding a first circuit member comprising a first electrode and a second circuit member comprising a second electrode to each other and electrically connecting the first electrode and the second electrode to each other,
- wherein the conductive particle comprises an outermost surface layer made of Pd or Au,
- wherein at least one of the first electrode and the second electrode comprises an outermost surface layer made of Cu, and
- wherein the outermost surface layer of the conductive particle has a thickness of 50 nm or less.
Dependencies are inferred from the claim text.