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US 11,887,401 B2Granted
Display backplane, manufacturing method thereof, and full-screen fingerprint identification display device
AssigneesBeijing BOE Technology Development Co., Ltd., Boe Technology Group Co., Ltd.
InventorsXueguang Hao, Hongfei Cheng, Yongda Ma
Life of this patent
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Abstract
The present disclosure provides a display backplane, a method for manufacturing the same and a full-screen fingerprint identification display device. The display backplane includes a substrate; a circuit layer disposed on a surface of the substrate; a light emitting device layer disposed on a surface of the circuit layer away from the substrate; and a plurality of fingerprint identification photodetectors disposed in at least one of the circuit layer and the light emitting device layer.
Claims16
A display backplane, comprising:
- a substrate;
- a circuit layer disposed on a surface of the substrate;
- a light emitting device layer disposed on a surface of the circuit layer away from the substrate;
- and
- a plurality of fingerprint identification photodetectors disposed in at least one of the circuit layer and the light emitting device layer,
- wherein included angles between photosensitive surfaces of the fingerprint identification photodetectors and the substrate are greater than or equal to 15° and less than or equal to 45°.
3 more elements
Dependencies are inferred from the claim text.