US 11,886,115 B1 · Resin, positive photosensitive resin composition and use

Abstract

A positive photosensitive resin composition comprises a resin, a diazonaphthoquinone compound and a solvent. The resin comprises a combination of any one or more of polyamic acid, polyamic ester and polyimide of a segment shown in the following structure; . The resin film formed by the positive photosensitive resin composition is applied to a semiconductor passivation film, a semiconductor element protective film, an insulating layer of an organic electroluminescent element, a flat film of a thin film transistor (TFT) substrate, a wiring protective insulating film of a circuit board and a flat film for displays and solid camera elements. The photosensitive resin film formed by the positive photosensitive resin composition has the characteristics of low shrinking rate and excellent heat resistance and resolving power, and has good application effect in electronic elements.

Claims7

Dependent claims

A positive photosensitive resin composition, comprising a resin, a diazonaphthoquinone compound and a solvent, wherein the resin is a combination of any one or more of polyamic acid, polyamic ester and polyimide of a segment shown in formula (1);

in the formula (1), X represents a tetravalent organic group;
R1 is a hydrogen atom or a C1-10 organic group;
Y represents a bivalent organic group constituting the resin, and at least comprises a general structure formula (2):
in the formula (2), Y1 is any one of:
and
and * represents a linkage position;
R2 in the formula (2) is selected from —NHCO— or —O—;
n in the formula (1) is an integer in a range of 10-100000;
the organic group in the formula (2) is derived from one or more of the following diamine b-1-1 to b-1-8:
a weight ratio of the resin to the solvent is 1:(5-80);
a weight ratio of the resin to the diazonaphthoquinone compound is 100:(1-100).

8 more elements

Dependencies are inferred from the claim text.

Resin, positive photosensitive resin composition and use

Life of this patent

Resin, positive photosensitive resin composition and use

Life of this patent

Abstract

Claims7