Display panel motherboard, cutting method and manufacturing method thereof, display panel, and display device

A cutting method of a display panel motherboard, wherein the display panel motherboard comprises at least three mother substrates, at least one display panel unit, and a cutting region, the at least three mother substrates are laminated with each other, at least a portion of the at least one display panel unit is surrounded by the cutting region, and an organic film layer is not disposed in at least two of the at least three mother substrates in the cutting region;

• and
• the cutting method comprises:
• cutting the display panel motherboard along at least one cutting line in the cutting region to form at least one display panel,
• wherein the display panel corresponds to the display panel unit;
• the cutting the display panel motherboard along the at least one cutting line in the cutting region to form the at least one display panel comprises:
• cutting the display panel motherboard with an energy cutting beam along a first cutting line in the cutting region, to allow at least one portion to be processed to be separated from the display panel motherboard, wherein each of the at least one portion to be processed comprises one display panel unit;
• the cutting the display panel motherboard along the at least one cutting line in the cutting region to form the at least one display panel further comprises:
• mechanically cutting at least one mother substrate of the portion to be processed along a second cutting line to form the display panel on a side of the portion to be processed where a bonding region is located;
• wherein the at least three mother substrates comprise a first mother substrate, a second mother substrate, and a third mother substrate;
• and
• the mechanically cutting the at least one mother substrate of the portion to be processed along the second cutting line to form the display panel comprises:
• mechanically cutting a first mother substrate of the portion to be processed along a first sub-cutting line to form a first substrate of the display panel, and
• mechanically cutting a second mother substrate of the portion to be processed along a second sub-cutting line to form a second substrate of the display panel,
• wherein the first sub-cutting line is on a side of the second sub-cutting line away from the first cutting line.

A manufacturing method of a display panel motherboard, comprising:

• forming a display panel motherboard comprising at least one display panel unit,
• wherein the display panel motherboard comprises:
• at least three mother substrates stacked with each other;
• the at least one display panel unit;
• and
• a cutting region, at least a portion of the at least one display panel unit being surrounded by the cutting region,
• wherein an organic film layer is not disposed in at least two of the at least three mother substrates in the cutting region;
• the forming the display panel motherboard comprising the at least one display panel unit comprises:
• forming each of the at least three mother substrates, respectively, and
• assembling the at least three mother substrates to form the display panel motherboard,
• wherein a step of forming the each of the at least three mother substrates, respectively, comprises:
• etching and removing organic film layers of the at least two of the at least three mother substrates in the cutting region;
• wherein in each of the at least one display panel unit, at least one of the at least three mother substrates comprises a bonding region;
• on a mother substrate in which an organic film layer is not disposed in the cutting region and comprising the bonding region, the organic film layer is not disposed in the bonding region;
• and
• the step of forming the each of the at least three mother substrates, respectively, further comprises:
• etching and removing the organic film layer in the bonding region of the mother substrate in which an organic film layer is not disposed in the cutting region and comprising the bonding region.