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US 11,886,023 B2Granted
Photonic optoelectronic module packaging
AssigneeII-Vi Delaware, Inc.
InventorsGilles P. Denoyer, Daniel Mahgerefteh, Vipul Bhatt, Shiyun Lin, Brian Kim
Life of this patent
Estimating the term…
Abstract
In one example, an optoelectronic module may include a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, an interposer electrically and mechanically coupled to the stack assembly, and an optical connector to optically couple the optical integrated circuit with an array of optical fibers.
Claims21
An optoelectronic module, comprising:
- a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, the optical integrated circuit comprising a first array of electrical couplings positioned around the electrical integrated circuit on a first face of the optical integrated circuit;
- an interposer electrically and mechanically coupled to the stack assembly via the first array of electrical couplings and a second array of electrical couplings positioned around a first recess formed in a first face of the interposer;
- an adiabatic mode converter positioned in a second recess defined in a side of the interposer, the first recess being separated from the second recess by a portion of the interposer underlying the second array of electrical couplings;
- and
- an optical connector positioned in the second recess and configured to optically couple the optical integrated circuit with an array of optical fibers,
- wherein the electrical integrated circuit extends at least partially within the first recess of the interposer.
3 more elements
An optoelectronic module, comprising:
- an optical integrated circuit comprising a first array of electrical couplings on a first face of the optical integrated circuit;
- an interposer coupled to the optical integrated circuit via the first array of electrical couplings and a second array of electrical couplings positioned around a first recess formed in a first face of the interposer;
- an adiabatic mode converter positioned within a second recess defined in a side of the interposer, the first recess being separated from the second recess by a portion of the interposer underlying the second array of electrical couplings;
- and
- an optical connector positioned in the second recess adjacent to the adiabatic mode converter,
- wherein the first face of the optical integrated circuit and the first face of the interposer are adjacent with the first array of electrical couplings and the second array of electrical couplings in between.
3 more elements
An optoelectronic module, comprising:
- a stack assembly including an electrical integrated circuit and an optical integrated circuit face-to-face bonded to one another;
- an interposer flip-chip bonded to the stack assembly via a first array of electrical couplings positioned on a first face of the optical integrated circuit and a second array of electrical couplings positioned on a first face of the interposer, the electrical integrated circuit being positioned to extend at least partially within a first recess formed in the first face of the interposer;
- an adiabatic mode converter positioned in a second recess defined in a side of the interposer;
- and
- an optical connector having at least a portion positioned in the second recess defined in the side of the interposer,
- wherein the first recess is separated from the second recess by a portion of the interposer underlying the second array of electrical couplings.
3 more elements
Dependencies are inferred from the claim text.