Probe tip assembly for testing optical components
AssigneeLumentum Operations LLC
InventorsSean Burns, Raman Srinivasan, Lucas Morales, Tian Shi, Yuanzhen Zhuang, Cho-Shuen Hsieh, Albert Huang
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Abstract
In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.
Claims20
A probe tip assembly, comprising:
- a driver printed circuit board assembly (PCBA);
- a probe tip subassembly comprising:
- an isolation layer including a first end and a second end, and
- a plurality of probe tips, wherein:
- a probe tip, of the plurality of probe tips, includes a first end and a second end,
- wherein the first end of the probe tip is aligned with the first end of the isolation layer,
- wherein the isolation layer is on only one side of the probe tip, and
- wherein the second end of the probe tip extends beyond the second end of the isolation layer;
- and
- a structural layer disposed on only one side of the isolation layer opposite the probe tip,
- the isolation layer being disposed between the probe tip and the structural layer;
- at least one high speed switch;
- and
- a conductive trace electrically connecting the at least one high speed switch and the probe tip through a via, the via extending from one end at a surface of the driver PCBA through the driver PCBA to another end at the probe tip, and
- the PCBA and the probe tip are configured to transmit an electric signal to test an optical component.
A probe tip subassembly, comprising:
- an isolation layer including a first end and a second end;
- a plurality of probe tips disposed on respective portions of a surface of the isolation layer wherein:
- a probe tip, of the plurality of probe tips, includes a first end and a second end,
- wherein the first end of the probe tip is aligned with the first end of the isolation layer,
- wherein the isolation layer is on only one side of the probe tip, and
- wherein the second end of the probe tip extends beyond the second end of the isolation layer;
- a structural layer disposed on only one side of the isolation layer opposite the probe tip,
- the isolation layer being disposed between the probe tip and the structural layer, and
- the probe tip is configured to transmit an electric signal to test an optical component;
- and
- a conductive trace electrically connecting the probe tip to an optical device through a via, the via extending from one end at a surface of a driver printed circuit board assembly (PCBA) through the driver PCBA to another end at the probe tip.
A probe tip subassembly, comprising:
- an isolation layer including a first end and a second end;
- a signal layer disposed on a surface of the isolation layer, wherein:
- an end of the signal layer is aligned with the first end of the isolation layer,
- the signal layer is on only one side of the isolation layer,
- a portion of the signal layer extends beyond the second end of the isolation layer, and
- the portion of the signal layer is configured to transmit an electric signal to test an optical component;
- a structural layer disposed on only one side of the isolation layer opposite the signal layer,
- the isolation layer being disposed between the structural layer and the signal layer;
- and
- a conductive trace electrically connecting the signal layer to an optical device through a via, the via extending from one end at a surface of a driver printed circuit board assembly (PCBA) through the driver PCBA to another end at the signal layer.
Dependencies are inferred from the claim text.