Back to results
US 11,885,736 B2Granted
Methods including panel bonding acts and electronic devices including cavities
AssigneeInfineon Technologies AG
InventorHorst Theuss
Life of this patent
Estimating the term…
Abstract
A method is disclosed. In one example, the method includes bonding a first panel of a first material to a base panel in a first gas atmosphere, wherein multiple hermetically sealed first cavities encapsulating gas of the first gas atmosphere are formed between the first panel and the base panel. The method further includes bonding a second panel of a second material to at least one of the base panel and the first panel, wherein multiple second cavities are formed between the second panel and the at least one of the base panel and the first panel.
Claims20
A device, comprising:
- a first cavity formed by a first cap of a first material bonded to a first surface of a base wherein the base is a planar base, wherein the first cavity hermetically seals a first gas and encapsulates a first electronic component, and wherein a portion of the first cavity is defined by the first surface of the base;
- and
- a second cavity formed by a second cap of a second material bonded to a second surface of the base, wherein a second electronic component is disposed in the second cavity, and wherein a portion of the second cavity is defined by the second surface of the base,
- wherein the first cap is spaced apart from the second cap.
1 more element
A device comprising:
- a first cavity formed by a first cap of a first material bonded to a first surface of a base wherein the base is a planar base, wherein the first cavity hermetically seals a first gas and encapsulates a first electronic component, and wherein a portion of the first cavity is defined by the first surface of the base;
- and
- a second cavity formed by a second cap of a second material bonded to one of a surface of the base and a surface of the second cap, wherein a second electronic component is disposed in the second cavity,
- wherein the first cap is spaced apart from the second cap.
1 more element
A device comprising:
- a first cavity formed by a first cap of a first material bonded to a first surface of a base wherein the base is a planar base, wherein the first cavity hermetically seals a first gas and encapsulates a first electronic component, and wherein a portion of the first cavity is defined by the first surface of the base;
- and
- a second cavity formed by a second cap of a second material bonded to a second surface of the base, wherein a second electronic component is disposed in the second cavity, wherein the second cap is spaced from the first cap by a gap or by the base, and wherein the second cavity is a portion of defined by the second surface of the base.
Dependencies are inferred from the claim text.