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US 11,885,621 B2Granted
Sensor device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKoichiro Nakashima, Takashi Uchida, Yusuke Nakamura, Hideki Ueda, Naruhito Noda, Toshitsugu Konishi, Toshio Yamazaki
Life of this patent
Estimating the term…
Abstract
A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.
Claims7
A sensor device comprising:
- a sensor element;
- a substrate over which the sensor element is provided;
- and
- a bonding wire forming at least part of a connection path that electrically connects the sensor element and the substrate together, the bonding wire being provided to connect two connection surfaces that intersect with each other;
- a supporting member installed over the substrate with the sensor element provided on the supporting member;
- and
- a coupling member that couples the supporting member to the substrate,
- wherein
- the sensor element is electrically connected to the substrate via the supporting member,
- one of the two connection surfaces is one surface of the supporting member,
- the supporting member is installed indirectly over the substrate via the coupling member, and
- an adhesive layer bonding the coupling member and the substrate together has a larger Young's modulus than an adhesive layer bonding the coupling member and the supporting member together.
9 more elements
Dependencies are inferred from the claim text.