Component having improved surface contact resistance and reaction activity and methods of making the same
AssigneeTreadstone Technologies, Inc.
InventorConghua Wang
Life of this patent
Estimating the term…
Abstract
A component for an electrochemical device, the component including: a metallic substrate; and a plurality of particles bonded to a surface of the substrate by a metallurgical bond, wherein the particles include a metal, carbon, or a combination thereof, wherein the metallurgical bond is between the particles and the substrate, wherein a total projected area of the metallurgical bond is less than 90% of a total projected area of the substrate, and wherein the metallurgical bond has a composition which is a combination of a composition of the metallic substrate and a composition of the particle, a reaction product of the metallic substrate and the particle, or a combination thereof.
Claims26
A component for an electrochemical device, the component comprising:
- a metallic substrate;
- and
- a plurality of particles bonded to a surface of the substrate by a metallurgical bond,
- wherein the particles comprise a metal, carbon, or a combination thereof,
- wherein the metallurgical bond is between the particles and the substrate,
- wherein a total projected area of the metallurgical bond between the particles and the substrate is less than 90% of a total projected area of the substrate, and
- wherein the metallurgical bond has a composition which is a combination of a composition of the metallic substrate and a composition of the particle, a reaction product of the metallic substrate and the particle, or a combination thereof.
A method of manufacturing a component for an electrochemical device, the method comprising:
- providing a metallic substrate;
- disposing a composition comprising a plurality of precursor particles on less than 90% of a total projected area of the metallic substrate, wherein the precursor particles comprise a metal, carbon, metal hydride or a combination thereof, to provide a coated substrate,
- wherein the precursor particles have an average particle size of less than 200 μm;
- and
- heat-treating the coated substrate to form particles from the precursor particles, and bond the particles to the substrate by a metallurgical bond formed between the particles and the metallic substrate to manufacture the component,
- wherein the metallurgical bond has a composition which is a combination of a composition of the metallic substrate and a composition of the particle, a reaction product of the substrate and the particle, or a combination thereof.
Dependencies are inferred from the claim text.