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US 11,884,900 B2Granted
Cleaning compositions and methods of use thereof
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsZachary L. Schaefer, Eric Turner, Carl Ballesteros
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Abstract
The present disclosure relates to cleaning compositions that are used to clean semiconductor substrates. These cleaning compositions can remove the defects/contaminants arising from previous processing on the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one pH adjusting agent and at least one biosurfactant.
Claims18
A method for cleaning a substrate, comprising:
- polishing a substrate by using a CMP composition to form a polished substrate;
- and
- contacting the polished substrate with a cleaning composition to clean the polished substrate,
- wherein the cleaning composition comprises:
- at least one pH adjusting agent;
- and
- at least one biosurfactant selected from the group consisting of glycolipids, lipopeptides, and mixtures thereof;
- wherein the cleaning composition has a pH of from about 1 to about 14.
5 more elements
Dependencies are inferred from the claim text.