Polishing composition, polishing method, and method of producing semiconductor substrate
AssigneeFujimi Incorporated
InventorRyota Mae
Life of this patent
Estimating the term…
Abstract
A polishing composition according to the present invention contains abrasive grains, a basic inorganic compound, an anionic water-soluble polymer, and a dispersing medium, in which a zeta potential of the abrasive grains is negative, an aspect ratio of the abrasive grains is 1.1 or less, in a particle size distribution of the abrasive grains obtained by a laser diffraction/scattering method, a ratio D90/D50 of a particle diameter D90 when an integrated particle mass reaches 90% of a total particle mass from a fine particle side to a particle diameter D50 when the integrated particle mass reaches 50% of the total particle mass from the fine particle side is more than 1.3, and the basic inorganic compound is an alkali metal salt.
Claims16
A polishing composition comprising:
- abrasive grains;
- a basic inorganic compound;
- an anionic water-soluble polymer;
- and a dispersing medium,
- wherein a zeta potential of the abrasive grains is negative,
- wherein the abrasive grains are alumina, wherein more than 50% of the alumina is in a γ-phase,
- an aspect ratio of the alumina is less than 1.1,
- in a particle size distribution of the abrasive grains obtained by a laser diffraction/scattering method, a ratio D90/D50 of a particle diameter D90 when an integrated particle mass reaches 90% of a total particle mass from a fine particle side to a particle diameter D50 when the integrated particle mass reaches 50% of the total particle mass from the fine particle side is more than 2.0, and
- the basic inorganic compound is an alkali metal salt.
A polishing composition consisting of:
- abrasive grains;
- a basic inorganic compound;
- an anionic water-soluble polymer;
- and a dispersing medium;
- or
- abrasive grains;
- a basic inorganic compound;
- an anionic water-soluble polymer;
- a dispersing medium;
- and an additive,
- wherein a zeta potential of the abrasive grains is negative,
- wherein the abrasive grains are alumina, wherein more than 50% of the alumina is in a γ-phase,
- an aspect ratio of the alumina is less than 1.1,
- in a particle size distribution of the abrasive grains obtained by a laser diffraction/scattering method, a ratio D90/D50 of a particle diameter D90 when an integrated particle mass reaches 90% of a total particle mass from a fine particle side to a particle diameter D50 when the integrated particle mass reaches 50% of the total particle mass from the fine particle side is more than 2.0,
- wherein the basic inorganic compound is an alkali metal salt,
- wherein the anionic water-soluble polymer is at least one selected from the group consisting of polyacrylic acid-based polymer and a polymethacrylic acid-based polymer, and
- wherein the additive is one or more selected from the group consisting of a pH adjusting agent, a chelating agent, a thickener, an oxidizing agent, a dispersant, a surface protectant, a wetting agent, a surfactant, a rust preventative, an antiseptic agent, and an antifungal agent.
Dependencies are inferred from the claim text.