Silicone gel composition and cured product thereof, and power module
AssigneeShin-Etsu Chemical Co., Ltd.
InventorTsuyoshi Matsuda
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AssigneeShin-Etsu Chemical Co., Ltd.
InventorTsuyoshi Matsuda
Estimating the term…
This silicone gel composition contains (A) an organopolysiloxane having one or more silicon atom-bonded alkenyl groups per molecule, (B) an organohydrogen polysiloxane having two or more silicon atom-bonded hydrogen atoms per molecule, (C) a platinum group metal-based curing catalyst, (D) an isocyanuric acid derivative having two trialkoxysilyl groups and one crosslinkable vinyl group and/or an isocyanuric acid derivative having three trialkoxysilyl groups, and (E) a ketenesilylacetal-type compound, and provides a cured product having a specific penetration. The silicone gel composition can provide a silicone gel cured product that is a silicone gel having excellent heat resistance and adhesiveness to metals at high temperature and having a high penetration, that is capable of maintaining a low elastic modulus and a low stress even in use at high temperature for long periods of time, and that enables reduction of the occurrence of bubbles and reduction of deterioration in releasability from a substrate and in electrical insulating properties.
A silicone gel composition comprising:
Dependencies are inferred from the claim text.