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US 11,884,814 B2Granted
Resin composition
AssigneeAjinomoto Co., Inc.
InventorMasatoshi Watanabe
Life of this patent
Estimating the term…
Abstract
Resin compositions including (A) a hollow organic polymer particle, (B) an epoxy resin, and (C) a curing agent provide cured products having a superior smear removal properties.
Claims15
A resin composition, comprising:
- (A) at least one hollow particle formed of an organic polymer of at least one monomer comprising an aromatic vinyl unsaturated monomer;
- (B) at least one epoxy resin;
- (C) at least one curing agent which is at least one selected from an active ester curing agent, a phenol curing agent, a naphthol curing agent, a benzoxazine curing agent, a carbodiimide curing agent, an amine curing accelerator, an imidazole curing accelerator, and a metal curing accelerator;
- (D) at least one silica;
- and
- (E) at least one phosphorus type flame retardant,
- wherein
- said at least one hollow particle (A) has an average particle diameter of 0.2 μm to 8 μm:
- said at least one hollow particle (A) is present in an amount of 3% to 50% by mass, based on 100% by mass of non-volatile components in the resin composition;
- said at least one epoxy resin (B) is present in an amount of 10% to 40% by mass, based on 100% by mass of non-volatile components in the resin composition;
- said at least one curing agent (C) is present in an amount of 0.01% to 30% by mass, based on 100% by mass of non-volatile components in the resin composition;
- said at least one silica (D) is present in an amount of 60% or less by mass, based on 100% by mass of non-volatile components in the resin composition;
- and
- said at least one phosphorus type flame retardant (E) is present in an amount of 0.1% to 10% by mass, based on 100% by mass of non-volatile components in the resin composition.
11 more elements
Dependencies are inferred from the claim text.