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US 11,884,805 B2Granted
Sealant and sealant composition for electrochemical device
AssigneeZeon Corporation
InventorKouichirou Maeda
Life of this patent
Estimating the term…
Abstract
A sealant for an electrochemical device contains (A) a polyisobutylene polymer and (B) a conjugated diene polymer. The sealant contains the (A) polyisobutylene polymer in a proportion of more than 60 mass % and not more than 98 mass % and the (B) conjugated diene polymer in a proportion of not less than 2 mass % and less than 40 mass % relative to the total mass of the (A) polyisobutylene polymer and the (B) conjugated diene polymer.
Claims3
A sealant for an electrochemical device comprising:
- (A) a polyisobutylene polymer;
- and (B) a conjugated diene polymer, wherein
- the (A) polyisobutylene polymer is contained in a proportion of more than 84 mass % and not more than 96 mass % and the (B) conjugated diene polymer is contained in a proportion of not less than 4 mass % and less than 16 mass % relative to total mass of the (A) polyisobutylene polymer and the (B) conjugated diene polymer.
Dependencies are inferred from the claim text.