Resin particles, conductive particles, conductive material and connection structure
AssigneeSekisui Chemical Co., Ltd.
InventorsHiroyuki Morita, Takeshi Wakiya
Life of this patent
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Abstract
Provided is a resin particle that can be uniformly brought into contact with an adherend, can effectively enhance adhesion to a conductive portion and impact resistance when electrodes are electrically connected to each other using a conductive particle having the conductive portion formed on a surface thereof, and further can effectively reduce connection resistance. In the resin particle according to the present invention, an exothermic peak is observed when differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere.
Claims11
A resin particle having an exothermic peak observed, where differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere, wherein the resin particle satisfies at least one configuration selected from the group consisting of a Configuration (1) and a Configuration (2), as follows:
- Configuration (1):
- among the exothermic peaks, an exothermic amount at the exothermic peak having the largest peak area is 2,000 mJ/mg or more and 25,000 mJ/mg or less;
- Configuration (2):
- an absolute value of a difference between a compressive elasticity modulus where the resin particle is compressed by 10% and the compressive elasticity modulus where the resin particle heated at 200° C. for 10 minutes is compressed by 10% is 180 N/mm2 or more.
Dependencies are inferred from the claim text.