Low-dielectric thermally curable resin composition and low dielectric material prepared therefrom

Abstract

This application relates to a low-dielectric thermally curable resin composition for solving a problem of increased transmission loss. In one aspect, the low-dielectric thermally curable resin composition includes a (meth)acrylic monomer having an alicyclic heterocycle, a polyfunctional (meth)acrylic monomer, an initiator, and a curing accelerator, and a low dielectric material prepared therefrom. Various embodiments can provide excellent low dielectric properties with a dielectric constant (Dk) in a high frequency area of 1 to 20 GHz of less than, for example, 3.28. In addition, the low dielectric material can have a significantly reduced transmission loss with a dissipation factor (Df) in an area of 1 to 20 GHz of less than, for example, 0.008, and thus, may implement excellent transmission properties in excellent 5G mobile communication.

Dependencies are inferred from the claim text.