Alkoxysilacyclic or acyloxysilacyclic compounds and methods for depositing films using same

A method for producing a dielectric film represented by the formula SivOwCxHyFz, where v+w+x+y+z=100%, v is from 10 to 35 atomic %, w is from 10 to 65 atomic %, x is from 5 to 40 atomic %, y is from 10 to 50 atomic % and z is from 0 to 15 atomic %, said method comprising:

• providing a substrate within a reaction chamber;
• introducing into the reaction chamber gaseous reagents including at least one structure-forming precursor comprising an alkoxysilacyclic or an acyloxysilacyclic compound, and a porogen, wherein the alkoxysilacyclic or the acyloxysilacyclic compound has a structure represented by Formula I:
• wherein X and Y are independently selected from the group consisting of OR1, OR2, and OC(O)R3, wherein R1-3 are each independently selected from the group consisting of a linear or branched C1 to C10 alkyl group, a linear or branched C2 to C10 alkenyl group, a linear or branched C2 to C10 alkynyl group, a C3 to C10 cyclic alkyl group, a C3 to C10 hetero-cyclic alkyl group, a C5 to C10 aryl group, and a C3 to C10 hetero-aryl group;
• and R4 is a C3 to C10 alkyl di-radical which forms a five-membered, or six-membered saturated cyclic ring with the Si atom, and optionally at least one oxygen source;
• applying energy to the gaseous reagents in the reaction chamber to induce reaction of the gaseous reagents to deposit a preliminary film on the substrate, wherein the preliminary film contains the porogen;
• and
• removing from the preliminary film at least a portion of the porogen to provide the porous dielectric film comprising pores and a dielectric constant of about 2.6 or less.