Device, package structure and manufacturing method of device
AssigneexMEMS Labs, Inc.
InventorsJemm Yue Liang, Chiung C. Lo, Martin George Lim, Wen-Chien Chen, Michael David Housholder, David Hong
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AssigneexMEMS Labs, Inc.
InventorsJemm Yue Liang, Chiung C. Lo, Martin George Lim, Wen-Chien Chen, Michael David Housholder, David Hong
Estimating the term…
A package structure includes a first substrate and a first device disposed on the first substrate. The first device includes at least one anchor structure, a film structure anchored by the anchor structure and an actuator configured to control the film structure to form a first vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal and a second volume connected to an ambient of a wearable sound device. The ear canal and the ambient are connected via the first vent when the first vent is opened. The first vent is opened by controlling a first membrane portion and a second membrane portion of the film structure, such that a difference between a first displacement of the first membrane portion and a second displacement of the second membrane portion is larger than a thickness of the film structure.
A package structure, disposed within a wearable sound device or to be disposed within the wearable sound device, the package structure comprising:
A device, disposed within a wearable sound device or to be disposed within the wearable sound device, the device comprising:
A device, comprising:
Dependencies are inferred from the claim text.