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US 11,884,470 B2Granted
Void fill packaging
AssigneePPC Industries, Inc.
InventorsChristopher Brewster, Allan Guillen, Renato Yutuc
Life of this patent
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Abstract
A void-fill package, and method of making the same, comprising at least 50%, on a weight basis of the package, recycled polyethylene; at least 40%, on a weight basis of the package, virgin polyethylene; at least one moisture scavenger; and at least one melt stabilizer.
Claims14
A void-fill package comprising:
- at least 50%, on a weight basis of the package, recycled polyethylene;
- at least 40%, on a weight basis of the package, virgin polyethylene;
- at least one moisture scavenger;
- and
- at least one melt stabilizer, wherein the at least one melt stabilizer comprises one of a propylene elastomer, medium density metallocene polyethylene, low density metallocene or linear low density metallocene polyethylene.
2 more elements
A void-fill package comprising:
- at least 50%, on a weight basis of the package, recycled octene copolymer linear low density polyethylene;
- at least 40%, on a weight basis of the package, virgin octene copolymer linear low density polyethylene;
- about 2%, on a weight basis of the package, of calcium oxide;
- and
- about 8%, on a weight basis of the package, of at least one melt stabilizer, wherein the at least one melt stabilizer comprises one of a propylene elastomer, medium density metallocene polyethylene, low density metallocene or linear low density metallocene polyethylene.
2 more elements
Dependencies are inferred from the claim text.