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US 11,883,926 B2Granted
Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device
AssigneeKioxia Corporation
InventorsTakahiko Kawasaki, Yukiteru Matsui, Akifumi Gawase
Life of this patent
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Abstract
A polishing pad is described. The polishing pad includes a surface having plural recess portions, and a substrate is polished by the surface. In the pad, an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 μm or less, and an average density of the recess portions at one area of the surface is 1,300/mm2 or more.
Claims16
A method of fabricating a semiconductor device, comprising:
- providing a polishing pad with a surface that has plural recess portions, wherein an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 μm or less, and an average density of the recess portions at one area of the surface is 1,300/mm2 or more;
- after providing the polishing pad, holding the polishing pad on a pad polishing table;
- after holding the polishing pad, supplying a polishing liquid to the surface of the polishing pad;
- after supplying the polishing liquid, polishing a substrate using the polishing liquid in a gap between the polishing pad that includes the surface having the plural recess portions and the substrate;
- and
- after polishing the substrate, dressing an upper surface of the polishing pad that includes the surface having the plural recess portion using a dresser.
3 more elements
A method of fabricating a semiconductor device, comprising:
- providing a polishing pad with a surface that has plural recess portions, wherein an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 μm or less, and an average density of the recess portions at one area of the surface is 1,300/mm2 or more;
- after providing the polishing pad, dressing the surface of the polishing pad with a dresser;
- after dressing the surface of the polishing pad, holding the dressed polishing pad on a polishing table, wherein the dressed polishing pad includes the surface having the plural recess portions;
- after holding the dressed polishing pad, supplying a slurry to the surface of the dressed polishing pad;
- and
- after supplying the slurry, polishing a substrate with the slurry in a gap between the dressed polishing pad that includes the surface having the plural recess portions and the substrate.
3 more elements
Dependencies are inferred from the claim text.