Drug eluting implants and methods for producing the same

A method for producing a temporary medical implant comprising:

• pulverizing at least one therapeutic agent into a fine powder, then sifting and isolating the fine powder to attain therapeutic agent particles with a particle size distribution of less than 50 microns;
• creating a non-solid blend of a polymer and the therapeutic agent particles comprising between about 0.1 and about 20.0 weight percent of the therapeutic agent, wherein the weight percent is relative to a total weight of the non-solid blend;
• homogenizing the non-solid polymer blend via an immersion blender or homogenizer such that the therapeutic agent particles are distributed substantially evenly throughout the non-solid polymer blend;
• vat polymerizing the non-solid polymer blend containing at least one therapeutic agent to produce a therapeutic agent-eluting implant comprising the at least one therapeutic agent homogeneously distributed throughout the therapeutic agent-eluting implant;
• and
• cleaning and curing the therapeutic agent-eluting implant to produce a final device that supports physiologic loads when implanted within the patient, wherein:
• the therapeutic agent comprises of one or more of the following:
• antibiotic, antifungal, analgesic, or chemotherapeutic;
• the polymer comprises:
• 50-70 weight % of esterification products of 4,4′-isopropylidenediphenol, ethoxylated and 2-methylprop-2-enoic acid, 25-45 weight % of urethane dimethacrylate, 7-10 weight % of methacrylate monomer(s), and <2% of photoinitiator(s);
• the polymer has an initial boiling point/range of >100° C., a closed cup flash point of >93.5° C., a density of 1.09 g/cm3, a dynamic viscosity of 1350 cps at 25° C., and is not flammable;
• the therapeutic agent-eluting implant comprises a gyroid structure;
• the therapeutic agent-eluting implant comprises an arthroplasty spacer;
• and
• the therapeutic agent-eluting implant comprises a compressive yield stress greater than or equal to 50 MPa, an ultimate tensile strength of greater than or equal to 20 MPa, and a Compressive Modulus of greater than or equal to 1000 MPa.